BYPASS OP9000
Performance and Features Contents
Document Version
T2-0416xx-20050330-C-1.20
(March 2005)
HUAWEI TECHNOLOGIES CO.,
LTD.
- i -
Contents
1 Performance and Features ....................................................................................................... 1-1
1.1 Product Overview........................................................................................................................ 1-1
1.2 Performance and Features ........................................................................................................... 1-1
1.2.1 High-Performance of protect swith.................................................................................... 1-1
1.2.2 Guaranteed Reliability ....................................................................................................... 1-2
2 Hardware .................................................................................................................................... 2-1
2.1 Hardware Overview..................................................................................................................... 2-1
2.1.1 Appearance......................................................................................................................... 2-1
2.1.2 General Specifications ....................................................................................................... 2-2
2.2 Board Area................................................................................................................................... 2-3
3 Working Principle and Functions.......................................................................................... 3-1
3.1 System control and communication unit SCC............................................................................. 3-1
3.2 Dual-channel optical line protection board(DCP) ....................................................................... 3-4
3.3 Installing Optical Fiber................................................................................................................ 3-8
3.3.1 Fiber Connector ................................................................................................................. 3-8
3.3.2 Swapping Fiber Connector................................................................................................. 3-9
3.4 Requirements for Optical Fiber Management ........................................................................... 3-10
3.4.1 Basic Principles................................................................................................................ 3-10
3.4.2 Requirements for Fiber Routing ...................................................................................... 3-10
3.4.3 Requirements for Fiber Bundling .................................................................................... 3-11
3.4.4 Managing Fiber in Front Board Area............................................................................... 3-11
4 Protection.................................................................................................................................... 4-1
4.1 Input Power Supply Protection.................................................................................................... 4-1
4.2 Optical Line Protection................................................................................................................ 4-1
5 Technical Specifications .......................................................................................................... 5-1
5.1 DCP Board Specifications........................................................................................................... 5-1
5.2 Laser Security.............................................................................................................................. 5-1
5.3 Auxiliary Interfaces ..................................................................................................................... 5-1
5.4 Environmental Specifications...................................................................................................... 5-1
5.5 Electromagnetic Compatibility.................................................................................................... 5-2
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