3. Press down on the left and right side latches and pull the server out of the rack
enclosure until both slide rails lock.
4. Remove the cover, as described in “Removing the cover” on page 83.
5. Depending on which microprocessor you are removing, remove the following
components, if needed:
v Microprocessor 1: PCI riser card assembly 1 and DIMM air baffle, as
described in “Removing a PCI riser-card assembly” on page 99 and
“Removing the DIMM air baffle” on page 93.
Note: If there are two microprocessors, you must remove PCI riser card
assembly 2 and microprocessor 2 air baffle first, as described in “Removing a
PCI riser-card assembly” on page 99 and “Removing the microprocessor 2 air
baffle” on page 90.
v Microprocessor 2: PCI riser card assembly 2 and microprocessor 2 air baffle,
as described in “Removing a PCI riser-card assembly” on page 99 and
“Removing the microprocessor 2 air baffle” on page 90.
In the following step, keep each heat sink paired with its microprocessor for
reinstallation.
6. Remove the heat sink and microprocessor, as described in “Removing a
microprocessor and heat sink” on page 140.
7. Remove the four screws that secure the heat-sink retention module to the
system board; then, lift the heat-sink retention module from the system board.
8. If you are instructed to return the heat-sink retention module, follow all
packaging instructions, and use any packaging materials for shipping that are
supplied to you.
Installing a heat-sink retention module
The following procedure is for a field replaceable unit (FRU). FRUs must be
installed only by trained service technicians.
148 Storwize V7000 Unified: Problem Determination Guide Version
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