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Lenovo ThinkSystem ST650 V2 - Chapter 2. Server Components

Lenovo ThinkSystem ST650 V2
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Table 1. Specifications (continued)
Specification
Description
Environment
The ThinkSystem ST650 V2 server complies with ASHRAE Class A2 specifications.
Depending on the hardware configuration, some models comply with ASHRAE Class A3
and Class A4 specifications. System performance may be impacted when operating
temperature is outside ASHRAE A2 specification.
Air temperature:
Operating
ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
temperature decreases by 1°C for every 300 m (984 ft) increase in altitude
above 900 m (2,953 ft).
ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
temperature decreases by 1°C for every 175 m (574 ft) increase in altitude
above 900 m (2,953 ft).
ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
temperature decreases by 1°C for every 125 m (410 ft) increase in altitude
above 900 m (2,953 ft).
Server off: -10°C to 60°C (14°F to 140°F)
Shipment/storage: -40°C to 60°C (-40°F to 140°F)
Maximum altitude: 3,050 m (10,000 ft)
Relative Humidity (non-condensing):
Operating
ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
Shipment/storage: 8% to 90%
Particulate contamination
Attention: Airborne particulates and reactive gases acting alone or in combination
with other environmental factors such as humidity or temperature might pose a risk to
the server. For information about the limits for particulates and gases, see
“Particulate contamination” in ThinkSystem ST650 V2 Maintenance Manual.
Acoustical noise
emissions
The server has the following acoustic noise emissions declaration:
Sound power level (L
WAd)
Idling:
Min: 5.0 Bel
Typical: 5.6 Bel
GPU: 6.4 Bel
Operating:
Min: 5.6 Bel
Typical: 5.6 Bel
GPU: 8.2 Bel
Sound pressure level (L
pAm):
Idling:
Min: 37 dBA
Typical: 41 dBA
GPU: 48 dBA
Operating:
Min: 41 dBA
Typical: 41 dBA
GPU: 66 dBA
Chapter 1. Introduction 7

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