MI 2140 MI 2140 Omega &BetaPAT Instrument description
16
4.3.1. Earth bond test
The purpose of this test is to ensure that the resistance of connections between the
earth wire in the mains supply plug and the grounded metal parts of an appliance is
below allowed limits. The resistance limit, duration of measurement, output current and
the number of measurements are selectable according to the requirements. Before
testing, check that the test will not cause any damage to the appliance. Test with a
maximum current of 100 mA is applied when higher current can cause damage. This is
often necessary when computers or other information technology appliances are
checked.
Earth bond test of Class I appliances
For Class I appliances the test voltage is applied between PE terminal (L and N line are
of no importance) and Earth Bond clip.
OR
PPLIANCE
UNDER
TEST
Fig. 4.6 Connection for Class I appliance
Earth Bond test of IEC leads
When testing IEC leads, the lead end should be connected to the IEC CORD terminal.
This is convenient when performing a complete IEC CORD test (no need for
reconnection during test, no need for adapters).
IEC CORD
UNDER
TEST
Fig. 4.7 Earth bond test of IEC cord
To Next Page
Loading...
Need help?
General
