RGA Series Low profile fast rotation stage
A1355A0 – EDH0427En1010 – 04/21 2
2.0 Description
The RGA is the latest world class rotation stage from MKS that adds to the
breadth of readily-available, standard, precision stages. The RGA was
designed to move fast, with a low-profile and a large aperture. It addresses
the need for quick angle adjustments of wafers and vacuum chucks.
Although specifically tailored to semiconductor applications, the RGA can
also be utilized in other industrial applications, such as through hole
imaging/inspection or laser processing, automation or any general
positioning application that requires fast positioning response.
With a sub-mdeg MIM, the RGA is at the same level of positioning
precision as the industry-proven RGV stages. Compared to the RGV, the
lower profile RGA is able to handle faster speeds, similar MIM and loads up
to the typical weight of the chuck and wafer in semiconductor wafer
applications.
The excellent repeatability and mapped sub-mdeg accuracy of the RGA are
a result of MKS’ experience in design and precision manufacturing.
Tolerances down to micron level, enable almost perfect fits on the various
machined or ground components of the bearings and mounting surfaces of
the motor and encoder.
Design:
With a high peak torque output direct drive motor, the RGA can achieve
high accelerations needed to minimize move times. The single row bearing
design is manufactured to exacting tolerances, ensuring low wobble and
eccentricity, resulting lower, geometry-induced errors. This single row
bearing design is an improved version of those found in other MKS rotation
stages. The high resolution, non-contact encoder, enables the precise MIM
and repeatability needed for semiconductor wafer applications, coupled with
the high reliability required in industrial settings.
Mounting pads are included in the RGA in case the mounting surfaces are
not as flat as required. These pads distribute the weight and overcome the
flatness found in most commercially available isolation tables, leading to a
performance close to what is achieved under ideal conditions.
Unique features:
A number of features sets the RGA apart from other direct drive rotation
stages, including other MKS products. (low profile, fast rotation, large
aperture for chuck utilities, less Abbe error, wider bearing, less geometric
errors, so better wobble and eccentricity).
The RGA’s large aperture allows more utilities through the stage and
connected to the wafer chuck. More vacuum zones can be designed,
ensuring a flatter wafer. With more room the strain or drag from hoses
and/or cables are minimized, which increases reliability and reduces the
torque/power required to accelerate. For through hole applications, this
simply means larger samples can be inspected or processed.
The RGA’s low profile enables the lowest possible position of the wafer
relative to the XY which reduces the effect of geometrical errors from the
XY and also from the RGA. This eventually improves accuracy and
repeatability at the wafer level, providing better confidence in the
measurements or the process. With more accurate placement of the wafer,
this reduces the need to correct for these geometric errors, implying a
reduction is process times.
The high torque, direct drive motor enables high accelerations for fast
positioning or alignment of the wafer. High torque can overcome the
friction introduced by the hoses and cable. A non-contact motor means no
wear of the motor components, ensuring reliable operations for years. Fine
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