MSI CX61 - User Manual

This document outlines the disassembly procedures for the CX61/CR61 (MS-16GB) device, providing a comprehensive guide for technicians and users who need to access internal components for repair, replacement, or maintenance. The manual details the step-by-step process for removing various modules, ensuring that each component is handled correctly to prevent damage. It emphasizes the importance of proper screw management and torque specifications, which are critical for reassembly and maintaining the device's structural integrity.

The disassembly process begins with the removal of the battery pack, a fundamental first step for any electronic device repair to ensure safety and prevent electrical shorts. The guide clearly illustrates how to unlock and release the battery, providing visual cues to aid the user. Following this, the bottom door assembly is removed, granting access to the internal components. This section highlights the number and type of screws involved, along with specific torque recommendations for reassembly, underscoring the precision required for handling small electronic components.

Next, the document details the removal of the HDD (Hard Disk Drive) module. This involves detaching the module from its bracket and then separating the bracket itself. The instructions are meticulous, specifying different screw types and their corresponding torque values for both the module and its bracket. This level of detail is crucial for ensuring that the HDD, a sensitive data storage component, is removed and reinstalled without damage.

A significant portion of the guide is dedicated to the thermal-kit, CPU, DRAM, and wireless modules. These components are central to the device's performance and often require attention during maintenance. The manual provides clear instructions for removing the fan, heatsink, and CPU, emphasizing the delicate nature of these parts. It also covers the removal of RAM modules and the wireless card, including the detachment of their antennas. For each step, specific screw sizes and torque specifications are provided, reinforcing the need for careful handling and precise reassembly. The process for opening the CPU slot with a screwdriver is also detailed, ensuring that the CPU module can be safely extracted.

The disassembly of the ODD (Optical Disk Drive) module is also covered, with instructions on how to remove it from the device, detach its bezel, and then separate it from its bracket. Again, the guide specifies the types and quantities of screws, along with the recommended torque settings, to ensure a smooth and damage-free process.

A critical section of the manual focuses on separating the upper and lower cases of the device. This involves a series of steps, starting with the removal of the keyboard. The guide explains how to detach the keyboard from the top, then from the sides, and finally from the bottom, followed by disconnecting its cable. It then proceeds to detail the removal of numerous screws that secure the upper and lower cases together, providing multiple images to illustrate the locations of these screws. Different screw types and their respective torque values are meticulously listed, highlighting the complexity of this stage and the importance of systematic screw management. The guide also instructs on disconnecting internal cables such as LVDS, speaker, MIC, and power cables before the cases can be fully separated.

Once the cases are separated, the guide moves on to the lower case assembly. This involves removing the USB board, the main board, and the IO board, each step accompanied by specific screw details and torque recommendations. The removal of the LCD hinges, both left and right, is also covered, with attention to the screws that stabilize them. The guide also includes instructions for removing the power connector and the speaker module from the lower case, ensuring that all components attached to the lower chassis can be accessed or removed as needed.

The upper case assembly section details the removal of the power board and the touchpad module. It explains how to detach the power board by removing its screws and then how to remove the touchpad module by first detaching its Mylar cover and then releasing its cable connector. This section, like others, provides precise screw specifications and torque values, ensuring that these sensitive input components are handled with care.

Finally, the LCD module assembly is addressed, which is often one of the most delicate parts of a device to disassemble. The guide provides instructions for removing the LCD bezel, starting from the top and working down the sides. It then details the removal of the left and right hinge caps, followed by the screws that stabilize the left and right hinges. The removal of the camera cable and the display module from the LCD cover is also explained, along with the disconnection of the LVDS cable. The guide further covers the removal of the display module itself, its brackets, the MIC module, the CMOS camera module, and the wireless antenna board from the LCD cover. For each of these steps, the document provides detailed screw specifications and torque values, underscoring the intricate nature of LCD disassembly and the need for extreme caution to avoid damaging the display or its associated components.

Throughout the manual, a consistent theme is the emphasis on screw specifications, including their size, type (e.g., M2.5*L5MM), color (black or white), and the recommended torque values for both removal and reassembly. This meticulous attention to detail is crucial for preventing stripped screws, damaged threads, or improper reassembly that could affect the device's functionality or structural integrity. The guide also includes a dedicated section on screw specifications, providing a visual reference for different screw types and their corresponding labels, which helps in organizing and identifying screws during the disassembly and reassembly process. This systematic approach to screw management is a key maintenance feature, ensuring that all fasteners are correctly identified and applied.

In summary, this disassembly guide for the CX61/CR61 (MS-16GB) device serves as an invaluable resource for anyone undertaking repairs or maintenance. Its detailed, step-by-step instructions, coupled with precise screw specifications and torque recommendations, ensure that the device can be safely and effectively disassembled and reassembled, preserving its functionality and extending its lifespan. The clear visual aids and comprehensive component lists further enhance its utility, making complex procedures manageable for users with varying levels of technical expertise.

MSI CX61 Specifications

General

Bus type	DMI
Stepping	L1
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-3210M
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-3200 Mobile series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	25
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel HM76 Express
Internal memory	8 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
HDD speed	5400 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	Memory Stick (MS), MMC, SD, SDHC, SDXC
Number of HDDs installed	1
Display surface	Gloss
Display diagonal	15.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x166
Discrete graphics card model	NVIDIA® GeForce® GT 645M
On-board graphics card model	Intel® HD Graphics 4000
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR3
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
Graphics card family	Intel, NVIDIA
Ethernet interface type	Gigabit Ethernet
Audio system	SRS
Video capturing speed	30 fps
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Cabling technology	10/100/1000Base-T(X)
Top Wi-Fi standard	Wi-Fi 4 (802.11n)
Networking features	Gigabit LAN, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDMI version	1.4
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity	0
Keyboard layout	-
Pointing device	Touchpad
Keyboard number of keys	102
Operating system installed	Windows 8
Form factor	Clamshell
Product type	Laptop
Product color	Black
Battery life (max)	- h
Number of battery cells	6
Processor code	SR0N0
Processor ARK ID	65708
Processor package size	31.0 x 24.0 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00