Siemens simatic et200sp Equipment Manual

Technical specifications
CPU 1510SP-1 PN (6ES7510-1DJ01-0AB0)
Equipment Manual, 05/2021, A5E03506268-AD
31
Article number
6ES7510-1DJ01-0AB0
per CM/CP
– Inputs (volume)
8 kbyte
– Outputs (volume)
8 kbyte
Subprocess images
•
Number of subprocess images, max.
32
Address space per module
•
Address space per module, max.
288 byte; For input and output data respectively
Address space per station
• Address space per station, max.
2 560 byte; for central inputs and outputs; de-
pending on configuration; 2 048 bytes for ET
200SP modules + 512 bytes for ET 200AL mod-
ules
Hardware configuration
Number of distributed IO systems
32; A distributed I/O system is characterized not
only by the integration of distributed I/O via
PROFINET or PROFIBUS communication modules,
but also by the connection of I/O via AS-i master
modules or links (e.g. IE/PB-Link)
Number of DP masters
• Via CM
1
Number of IO Controllers
•
integrated
1
•
Via CM
0
Rack
• Modules per rack, max.
80; CPU + 64 modules + server module (mounting
width max. 1 m) + 16 ET 200AL modules
• Quantity of operable ET 200SP modules,
max.
64
• Quantity of operable ET 200AL modules,
max.
16
•
Number of lines, max.
1
PtP CM
• Number of PtP CMs
the number of connectable PtP CMs is only limited
by the number of available slots
Time of day
Clock
•
Type
Hardware clock
•
Backup time
6 wk; At 40 °C ambient temperature, typically
•
Deviation per day, max.
10 s; Typ.: 2 s
Operating hours counter
• Number
16

Siemens simatic et200sp Specifications

General

Category	I/O Systems
Power Supply	24 V DC
Protection Rating	IP20
Number of Modules	Up to 64 modules
Mounting	DIN Rail
Communication Protocols	PROFINET, PROFIBUS
Storage Temperature	-40 °C to +70 °C
Digital Inputs	Yes (depending on module)
Digital Outputs	Yes (depending on module)
Analog Inputs	Yes (depending on module)
Analog Outputs	Yes (depending on module)
Modularity	Modular
Relative Humidity	5 to 95% (non-condensing)
Weight	Varies by configuration
System Type	Distributed I/O