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SIM7000 _Hardware Design _V1.00 2017-05-23
6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 33: The ramp-soak-spike reflow profile of SIM7000
Note: For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
SIM7000 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 34: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
Mandatory bake before use. After bake, it must be reflowed within the
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