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General| Frequency Bands (TDD LTE) | B38/B39/B40/B41 |
|---|---|
| GSM/GPRS/EDGE | 850/900/1800/1900 MHz |
| Operating Temperature | -40°C to +85°C |
| GNSS | GPS/GLONASS/BeiDou/Galileo/QZSS |
| Frequency Bands (FDD LTE) | B1/B2/B3/B4/B5/B7/B8/B12/B13/B20/B25/B26/B28 |
| UMTS/HSPA+ | B1/B2/B5/B8 |
| Data Rate (DL) | 150 Mbps |
| Data Rate (UL) | 50 Mbps |
| Interface | USB, UART, SPI, I2C, GPIO |
| Power Supply | 3.4V to 4.2V |
| LTE Category | Cat 4 |
Details FCC compliance rules and cautions for the device.
Outlines FCC limits for Class B digital devices and interference.
Provides general product information and disclaimers.
States the copyright ownership and terms.
Introduces the manual's purpose and scope.
Details document revision history and changes.
Describes features, supported standards, and physical dimensions.
Lists module hardware interfaces.
Summarizes module capabilities and features.
High-level view of module pin assignments.
Details pin types, definitions, and specific pin descriptions.
Shows module physical dimensions.
Provides PCB footprint recommendations for the module.
Guides on power supply requirements and circuits.
Explains module power control and reset.
Details UART interface design and usage.
Details USB interface design and usage.
Details USIM interface characteristics and application.
Covers PCM interface formats, timing, and design.
Details I2C interface design and usage.
Describes the NETLIGHT pin for network status.
Describes the STATUS pin for operating status.
Explains alternate functions for module pins.
Describes the ISINK pin functionality and characteristics.
Details the ADC pin's electronic characteristics.
Details LTE transmission power, frequencies, and sensitivity.
Provides guidelines for LTE antenna matching and trace design.
Outlines GNSS technical specs and application guides.
Specifies absolute maximum ratings and recommended operating conditions.
Details 1.8V digital I/O characteristics.
Defines module operating modes.
Details current consumption characteristics.
Explains sleep mode functionality and conditions.
Advises on ESD sensitivity and protection measures.
Shows module views for SMT.
Details soldering profile recommendations.
Explains MSL classification and handling.
Recommends stencil foil thickness.
Details module packaging methods and tray drawings.
Presents a typical reference circuit design for the module.
Lists GPRS, EDGE, HSDPA, and LTE data rates.
Lists related documents for further technical information.
Provides a glossary of terms and abbreviations.
Outlines important safety precautions for using the module.
Provides contact information for SIMCom support.
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