CDX-1150
– 15 – – 16 –
3-3. PRINTED WIRING BOARDS — MAIN SECTION —
(LIMIT)
SW3
(DISC IN 2)
SW2
(DISC IN 1)
SW4
CHUCKING
DET
( )
-
+
-
+
-
+
Ref. No. Location
(D501) B-10
D503 B-13
D504 B-12
D505 C-11
D506 D-13
D507 D-12
D508 E-11
D509 F-11
D510 E-12
D511 B-4
D512 E-10
D513 B-8
D514 D-8
D516 B-12
D517 B-12
D518 C-12
D519 B-2
D550 C-4
D551 B-4
D552 C-4
D602 J-12
IC101 G-7
IC102 G-5
IC103 J-4
IC400 D-5
(IC500) B-6
IC600 H-11
IC601 I-9
IC700 D-3
Q101 F-4
Q401 B-3
Q402 C-5
Q403 C-6
Q501 D-11
Q502 D-11
Q503 F-13
Q504 G-12
Q505 C-11
Q506 C-13
Q507 D-12
Q508 C-7
Q509 E-11
Q510 E-12
Q511 E-10
Q512 C-8
(Q513) A-8
Q514 C-8
Q515 D-7
Q516 B-3
Q517 F-11
Q550 B-3
Q551 B-4
Q601 J-12
Q701 G-2
Q702 G-2
Q703 J-7
Q704 F-2
Q705 F-3
• Semiconductor
Location
( ) : SIDE B
Note:
•
®
: Through hole.
•
¢
: internal component.
• b : Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.