Sony Trinitron BVM-A14F5M - Page 114

6-58
BVM-A14
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HC BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1091-403-A s MOUNTED CIRCUIT BOARD, HC
3pcs 4-042-408-02 o PIN (45), WIRE (CLP101,102,103)
C151 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C152 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C153 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C154 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C156 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C157 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C158 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C159 1-131-661-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C160 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C161 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C162 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C163 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C164 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C165 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C168 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C169 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C170 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C171 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C172 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C173 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C174 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C175 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C300 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C301 1-131-661-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C302 1-126-412-21 s CAP, CHIP ELECT 220MF (4X5.7)
C303 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C304 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C305 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C306 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C307 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C308 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C309 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C310 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C311 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C312 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C313 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C314 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C315 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C316 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C317 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C318 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C319 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C320 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C321 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C322 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C323 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C324 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C325 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C328 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C329 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C330 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C331 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C332 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C333 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C334 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C350 1-131-661-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C351 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
(HC BOARD)
Ref. No.
or Q’ty Part No. SP Description
C352 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C353 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C354 1-125-817-91 s CAP, CERAMIC 10MF B (3216)
C355 1-126-394-21 s CAP, CHIP ELECT 10MF (4X5.7)
C356 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C357 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C358 1-126-394-21 s CAP, CHIP ELECT 10MF (4X5.7)
C359 1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C360 1-128-934-91 s CAP,CHIP CERAMIC 0.33MF B 1608
C363 1-119-866-91 s CAP,CHIP CERAMIC 0.68MF B 2012
C364 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C365 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C366 1-125-817-91 s CAP, CERAMIC 10MF B (3216)
C367 1-115-433-91 s CAP, CHIP CERAMIC390PF CH 1608
C368 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C370 1-128-590-21 s CAP, CHIP ELECT 100MF
C371 1-164-172-91 s CAP,CERAMIC 5600PF B 1608
C372 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C373 1-126-394-21 s CAP, CHIP ELECT 10MF (4X5.7)
C375 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C376 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C377 1-135-342-21 s CAP, ELECT 56MF (6.3X6)
C378 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C379 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C380 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C381 1-135-344-21 s CAP, ELECT 270MF (10X8)
C382 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C383 1-165-908-91 s CAP, CERAMIC 1000000PF B 1608
C384 1-128-590-21 s CAP, CHIP ELECT 100MF
C385 1-135-344-21 s CAP, ELECT 270MF (10X8)
C386 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C388 1-135-344-21 s CAP, ELECT 270MF (10X8)
C389 1-135-344-21 s CAP, ELECT 270MF (10X8)
C390 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C391 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C392 1-165-671-21 s CAP, ELECT 470MF
C393 1-165-671-21 s CAP, ELECT 470MF
C394 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C395 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C396 1-165-671-21 s CAP, ELECT 470MF
C397 1-165-671-21 s CAP, ELECT 470MF
C398 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C399 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C400 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C401 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C402 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C403 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C404 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C405 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C407 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C408 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C409 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C410 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C411 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C412 1-126-392-21 s CAP, CHIP ELECT 100MF(6.3X5.7)
C413 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C414 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C415 1-162-970-91 s CAP, CERAMIC 10000PF B 1608
C416 1-165-989-91 s CAP, CERAMIC 10MF (2012)