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Appendix B: System Specications
Appendix B
System Specications
Processors
Single AMD EPYC™ 9004 Series Processor
Chipset
System on Chip
BIOS
Clock) wakeup, and SMBIOS 3.0 or later
Memory
Twelve DIMM slots to support up to 3TB ECC DDR5-4800MHz memory
Storage Drives
Ten hot-swap 2.5" SAS/SATA/NVMe front drive bays
Two Gen 3 M.2 NVMe PCIe 3.0x2 SSDs for boot drive
PCI Expansion Slots
Two PCIe 5.0 x16 (FHHL) slots
Input/Output
Network: One or two AIOM modules (OCP 3.0 NIC)
BMC: Dedicated LAN port
USB: Two rear USB 3.0 ports, two front USB 2.0 ports
Video : One VGA port
COM: One serial port
Motherboard
H13SSW; 12.29" (W) x13.4" (L) (312.16 x 340.36 mm)
Chassis
CSE-LB16TS-R860AWP-A; 1U Rackmount, (WxHxD) 17.2 x 1.7 x 23.5 in. (43.7 x 4.3 x 60 cm)
System Cooling
Power Supply
Model: PWS-860P-1R2, 860W redundant modules, 80Plus Platinum level*
AC Input
800W: 100-127Vac / 9A-7.5A / 50-60Hz
860W: 200-240Vac / 6A-4.5A / 50-60Hz
+12V
Max: 66.6A / Min: 0A (100Vac-127Vac)
Max: 71.6A / Min: 0A (200Vac-240Vac)
5V SB
Max: 4A / Min: 0A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)*
*Operating temperature is based on the configurations.
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)