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Appendix B: System Specications
Appendix B
System Specications
Processors
Single 4th Gen Intel Xeon Scalable processor, P+ (LGA4189) sockets; up to 300W TDP (350W with conditions)
Chipset
Intel PCH C741
BIOS
Clock) wakeup, and SMBIOS 3.0 or later
Memory
16 DIMM slots that support up to 4TB DDR5 RDIMM to 4800MT/s
Storage Drives
Ten hot-swap 2.5" SATA (default) drive bays (Ten optional NVMe drive bays by additional cables or SAS3 via optional AOC)
Two M.2 PCIe 3.0 x2 M-Key NVMe
PCI Expansion Slots
Two PCIe 5.0 x16 (FHHL)
Two PCIe 5.0 x16 AIOM (default)
Input/Output
One RJ45 dedicated IPMI LAN port
Two USB 3.2 Gen1 ports (rear)
Two USB 2.0 ports (front)
One VGA port
One serial (COM) port (rear)
Motherboard
X13SEDW-F; proprietary 12.29" (W) x 13.4" (L) (312.1 mm x 328.3 mm)
Chassis
CSE-LB16TS-R860AW3; 1U Rackmount, (WxHxD) 17.2” x 1.7” x 23.5” (437 x 43 x 597mm)
System Cooling
Six 40x40x56mm counter-rotating PWM fans
Power Supply
Model: PWS-860P-1R2, 860W dual redundant modules, 80Plus Platinum level
Input:
800W @ 100-127Vac
860W @ 200-240Vac
860W @ 240Vdc (CCC only)
50-60Hz
Output
+12V 66.6A (800W) / 71.6A (860W
+5Vsb 4A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -30º to 60º C (-22º to 140º F)