EasyManua.ls Logo

Teletype 28 - Page 40

Teletype 28
176 pages
Print Icon
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
SECTION
573-118-700TC
2.
30
Punch
Mechanism
for
Chadless
Tape
(continued)
Note:
Adjustments
on
this
page
do
not
apply to
tape
printer.
(B)
TAPE
GUIDE ASSEMBLY SPRING·
Requirement
Tape
guide
assembly
should
be
free
to
return
to
rest
against
tape
guide
block
after
a
Min
16
oz
-------------,
is
used
to
pull
tape
guide
assembly
away
from
block.
To
Adjust
Replace
spring
if
requirement
is
not
met.
If
tape
guide
assembly
is
not
free
to
return,
reposition
tape
guide
assembly
mounting
post
to
free
tape
guide
assembly.
I
I
I
: 0
I
I
.---.,
I I 0 1
._...
L.;....J
0
0
.....,---
(Top View)
BIAS SPRING
TAPE
(C) BIAS SPRING (PUNCH BLOCK)
(1)
Requirement
(A)
BIAS SPRING (TAPE CHUTE)
Requirement
Clutch disengaged
and
tape
threaded
through punch
assembly,
it
should
require
~---Min
1-1/4
oz---Max
2-1/4
oz
to
just
move
spring
away
from
tape.
To
Adjust
Bend
spring.
Note:
In
order
to
check
this
spring
tension
Oii'Units equipped with
backspace
mechanism,
it
is
necessary
to
remove
several
parts.
It
should not be
checked
unless
there
is
reason
to
believe
that
requirements
cannot
be
met.
With
tape
removed
from
punch
block,
bias
spring
should
rest
against
clearance
slot
in
block
in
a
symmetrical
manner.
------------.....,j~
(2)
Requirement
With
tape
in
punch
block
and
perforator
operating
under
power,
spring
should
not
distort
edge
of
tape.
To
Adjust
Bend
spring
and
positioo
it
with
its
mounUng
screw
loosened.
Tighten
screw.
Page
40
(Top VieW)
··~
,,~

Other manuals for Teletype 28

Related product manuals