Telit Wireless Solutions LE910C1 Series User Manual

LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
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10.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested
thickness of stencil foil is greater than 120 µm.
10.5. PCB Pad Design
The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type.
Figure 25: PCB Pad Design

Telit Wireless Solutions LE910C1 Series Specifications

General

Brand	Telit Wireless Solutions
Model	LE910C1 Series
Category	Control Unit
Language	English