LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
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Table 39: Solder Profile Characteristics
Profile Feature Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature min (Tsmin)
– Temperature max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak temperature (Tp) 245 +0/-5°C
Time within 5°C of actual peak
Temperature (tp)
10-30 seconds
Ramp-down rate 6°C/second max
Time 25°C to peak temperature 8 minutes max
NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
Warning:
The LE910C1 module withstands one reflow process only.
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