LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Confidential Information, provided under NDA Page
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9. Miscellaneous Functions .................................................................................. 92
9.1. Indication of Network Service Availability ....................................................... 92
9.2. Indication of Software Ready ........................................................................... 93
9.3. RTC – Real Time Clock ...................................................................................... 93
9.4. VAUX Power Output ........................................................................................ 93
9.5. ADC Converter ................................................................................................. 94
9.5.1. Description............................................................................................ 94
9.5.2. Using the ADC Converter ...................................................................... 94
9.6. Using the Temperature Monitor Function ...................................................... 94
9.7. GNSS Characteristics ........................................................................................ 95
10. Mounting the Module on your Board ............................................................... 96
10.1. General ............................................................................................................. 96
10.2. Finishing & Dimensions .................................................................................... 96
10.3. Recommended Footprint for the Application ................................................. 99
10.4. Stencil ............................................................................................................. 100
10.5. PCB Pad Design .............................................................................................. 100
10.6. Recommendations for PCB Pad Dimensions (mm) ........................................ 101
10.7. Solder Paste ................................................................................................... 102
10.7.1. Solder Reflow ...................................................................................... 102
11. Application Guide ........................................................................................... 104
11.1. Debug of the LE910C1 Module in Production ............................................... 104
11.2. Bypass Capacitor on Power Supplies ............................................................. 105
11.3. SIM Interface .................................................................................................. 106
11.3.1. SIM Schematic Example ...................................................................... 106
11.4. EMC Recommendations ................................................................................. 107
11.5. Download and Debug Port ............................................................................. 108
11.5.1. Fast Boot mode................................................................................... 108
11.5.2. Recovery Boot Mode .......................................................................... 108
12. Packing System ............................................................................................... 109
12.1. Packing system – Tray .................................................................................... 109
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