ME910C1 mPCIe HW Design Guide
1VV0301642 Rev. 2 Page 18 of 56 2022-01-14
An example of switching regulator with VIN=4V-36V input and 2.5A@3V3 output is shown
here below.
Figure 2 Switching regulator with 4V-36V input and 3.3V output
4.3.2. Thermal Design Guidelines
The thermal design of the application board and the power supply heat sink should be
done with the following specifications:
• Typical LTE average current consumption during ME910X1 mPCIe transmission
at maximum Power level and minimum input volage: 700 mA
• Average current during idle (USB enabled): 30 mA
• Average current during idle (USB disabled): 5 mA
• Average current during airplane mode (USB disabled): 2 mA
Considering the very low current during Idle, especially if the Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device absorbs
a significant current mainly during the Data session. In LTE mode, the ME910X1 mPCIe
emits RF signals continuously during transmission. Therefore, special attention must be
paid to how to dissipate the heat generated.
The ME910X1 mPCIe card is designed to distribute the heat from the module IC’s to the
entire PCB increasing as much as possible the heat dissipation.
For best performance, the application board copper layers should be used to dissipate
the heat out of the mPCIe card.
To ensure proper thermal flow from the mPCIe card to the application board, the mPCIe
card bottom side should be thermally connected to the application’s board top side via an
appropriate thermal pad.
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