Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 5 of 93
10 USB HSIC ................................................................................................................................................................. 55
11 SERIAL PORTS .......................................................................................................................................................... 56
11.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 57
11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 59
11.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 60
12 AUDIO SECTION OVERVIEW .................................................................................................................................... 62
12.1 ANALOG VOICE INTERFACE ................................................................................................................................................. 62
12.1.1 MIC connection .................................................................................................................................................... 63
12.1.2 LINE IN Connection ............................................................................................................................................... 65
12.1.3 EAR Connection .................................................................................................................................................... 66
12.2 DIGITAL VOICE INTERFACE .................................................................................................................................................. 67
12.2.1 Electrical Characteristics ...................................................................................................................................... 67
12.2.2 CODEC Examples .................................................................................................................................................. 67
13 GENERAL PURPOSE I/O ........................................................................................................................................... 68
13.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 69
13.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 70
13.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 70
13.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 71
13.5 RTC BYPASS OUT ............................................................................................................................................................. 72
13.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 72
13.7 VAUX POWER OUTPUT ..................................................................................................................................................... 72
13.8 ADC CONVERTER ............................................................................................................................................................. 73
13.8.1 Description ........................................................................................................................................................... 73
13.8.2 Using ADC Converter ............................................................................................................................................ 73
14 MOUNTING THE UE910 ON THE APPLICATION ........................................................................................................ 74
14.1 GENERAL ........................................................................................................................................................................ 74
14.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 74
14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 76
14.4 STENCIL .......................................................................................................................................................................... 77
14.5 PCB PAD DESIGN .............................................................................................................................................................. 77
14.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 78
14.7 SOLDER PASTE .................................................................................................................................................................. 80
14.7.1 UE910 Solder reflow ............................................................................................................................................. 80
14.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 82
14.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 84
14.9.1 Carrier Tape Detail ............................................................................................................................................... 84
14.9.2 Reel Detail ............................................................................................................................................................ 85
14.9.3 Packaging Detail .................................................................................................................................................. 86
14.10 MOISTURE SENSITIVITY .................................................................................................................................................... 86
15 SAFETY RECOMMANDATIONS ................................................................................................................................. 87
16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 88
16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 88
16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 91
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