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Telit Wireless Solutions UE910 series - Solder Paste; UE910 Solder Reflow

Telit Wireless Solutions UE910 series
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Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 80 of 93
14.7 Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules
after assembly.
14.7.1 UE910 Solder reflow
Recommended solder reflow profile:
DRAFT

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