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It is not recommended to place via or micro-via not covered by solder resist in an
area of 0,3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Electro-less Ni / Immersion
Au
good solder ability protection,
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is
suggested to use milled contours and predrilled board breakouts; scoring or v-cut
solutions are not recommended.
Inhibit area for micro-via
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