Telit Wireless Solutions UE910 series User Manual

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14.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
14.5 PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
DRAFT

Telit Wireless Solutions UE910 series Specifications

General

Brand	Telit Wireless Solutions
Model	UE910 series
Category	Control Unit
Language	English