Telit Wireless Solutions UE910 series - Stencil; Pcb Pad Design

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 77 of 93
14.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
14.5 PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
DRAFT