Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 9 of 93
1.7 Document History
Updated Chapters 5.2, 6.3, 6.4, 9, 11, 13.4, 15
Updated Chapters 13.4, 15.2
Updated Chapters 4, 5.1, 6.3, 12.4, 13.4, added Reel packaging chapter
Updated Chapters 3.1, 4.1, 4.2, 5.2, 7, 8.1, 10, 12.1
Updated Chapters 1.4, 1.6, 3.1, updated schematics and flow charts; added
USB HSIC; updated packaging drawing; added PCB Guidelines for FCC.
- Updated Chapter 11.2 deleted note under table
Updated Chapter 14.8 Packing system (Tray)
Updated Chapter 3.1.1 LGA Pads Layout – updated pin B1
Updated Chapter 3.1 Pin Out – updated pin B1 (deleted from Reserved pin)
Updated with UE910-GL product
Updated Chapter 3.1 Pin Out