Gap Bond Manager (GAPBondMgr)
www.ti.com
38
SWRU271H–October 2010–Revised April 2019
Submit Documentation Feedback
Copyright © 2010–2019, Texas Instruments Incorporated
The Bluetooth Low Energy Protocol Stack
5.4.2 Using the GapBondMgr Profile
The GAPBondMgr implements most of the functions in the overview. This section describes what the
application must do to configure, start, and use the GAPBondMgr. The GAPRole also handles some of the
functionality of the GAPBondMgr. The GAPBondMgr is defined in gapbondmgr.c. gapbondmgr.h.
describes the API including commands, configurable parameters, events, and callbacks. The steps to use
this module are as follows. The SimpleBLECentral project is the example because it uses the callback
functions from the GAPBondMgr.
1. Initialize the GAPBondMgr parameters. Do this in the application initialization function (that is,
SimpleBLECentral_init()). Consider the following parameters. For the example, the pairMode has been
changed to initiate pairing.
2. Register application callbacks with the GAPBondMgr. Do this registration after the GAPRole starts in
the START_DEVICE_EVT processing:
The GAPBondMgr is configured and operates autonomously. When a connection is established, the
GAPBondMgr initiates pairing and bonding depending on the configuration parameters from Step 1.
You can set a few parameters asynchronously such as GAPBOND_ERASE_ALLBONDS. All
communication between the GAPBondMgr and the application occurs through the callbacks that were
registered in Step 2. The following is a flow diagram example from SimpleBLECentral of the
GAPBondMgr, notifying the application that pairing has started. The following sections expand on
these callbacks.
To Next Page
Loading...
Need help?
General
