Texas Instruments DP83869 - Key Features; Figure 2-1. DP83869 EVM - Top Side

2.1 Key Features
• Multiple Operating Modes
– Media Support: Copper and Fiber
– Media Conversion: Copper to Fiber
– Bridge Conversion: RGMII to SGMII, SGMII to RGMII
• RGMII and SGMII MAC Interfaces
• 1000Base-X, 100Base-T, 100Base-TX, 10Base-Te
• USB-2-MDIO Support Through Onboard MSP430 for Easy Register Access
• Onboard LDO and External Power Supply Options
• Status LEDs
– Link
– Activity
– Power
• Bootstraps for Hardware Configuration
Figure 2-1. DP83869EVM – Top Side
Introduction www.ti.com
4 DP83869 Evaluation Module SNLU237A – SEPTEMBER 2018 – REVISED JANUARY 2024
Submit Document Feedback
Copyright © 2024 Texas Instruments Incorporated