3.3 Bill of Materials (BOM)
Table 3-1 lists the EVM BOM.
Table 3-1. TPS25730EVM Bill of Materials
Designator Quantity Value Description Package Reference Part Number Manufacturer
C1 1 4.7uF CAP, CERM, 4.7 uF, 35 V, +/- 10%,
X5R, 0603
0603 GRM188R6YA475KE15D MuRata
C2, C3 2 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 5%,
X7R, 0402
0402 C0402C103J5RACTU Kemet
C4, C5 2 330 pF CAP, CERM, 330 pF, 50 V, +/- 10%,
X7R, AEC-Q200 Grade 1, 0201
0201 CGA1A2X7R1H331K030BA TDK
C6 1 0.1uF CAP, CERM, 0.1 uF, 35 V, +/- 10%,
X5R, 0402
0402 GMK105BJ104KV-F Taiyo Yuden
C7, C8, C11 3 10uF CAP, CERM, 10 uF, 35 V, +/- 20%,
X5R, 0603
0603 GRM188R6YA106MA73D Murata
C9, C10, C12 3 10uF CAP, CERM, 10 uF, 10 V, +/- 20%,
X5R, 0402
0402 CL05A106MP5NUNC Samsung Electro-Mechanics
D1, D2, D3, D4,
D5, D6, D7, D8
8 White LED, White, SMD 0402 LW QH8G-Q2S2-3K5L-1 OSRAM
J1, J2 2 Receptacle, 2.54mm, 10x1, Gold, TH Receptacle, 2.54mm, 10x1,
Gold, TH
SSQ-110-23-F-S Samtec
J3 1 24 (6+18 Dummy) Position USB-C
(USB TYPE-C) USB 2.0 Receptacle
Connector
USB-C Connector USB4125-GF-A-0190 GCT
J4 1 Terminal Block, 5.08 mm, 2x1, TH Terminal Block, 5.08 mm, 2x1,
TH
1715721 Phoenix Contact
J5, J6, J7, J8 4 Header, 2.54mm, 2x1, Gold, TH Header, 2.54mm, 2x1, Gold,
TH
TSW-102-08-G-S Samtec
Q1, Q2, Q3, Q4,
Q5, Q6
6 20 V MOSFET, N-CH, 20 V, 0.5 A,
YJM0003A (PICOSTAR-3)
YJM0003A CSD15380F3 Texas Instruments
R1, R4, R7, R10,
R13, R16
6 10k RES, 10.0 k, 1%, 0.05 W, 0201 0201 RC0201FS-7D10KL Yageo America
R2, R5, R8, R11,
R14, R17
6 33k RES, 33.0 k, 1%, 0.05 W, 0201 0201 RC0201FR-0733KL Yageo America
R3, R6, R9, R12,
R15, R18
6 0 0 Ohms Jumper 0.1W, 1/10W
Chip Resistor 0603 (1608 Metric)
Automotive AEC-Q200 Thick Film
0603 ERJ-3GEY0R00V Panasonic
R19, R20, R21 3 1k RES, 10 k, 5%, 0.05 W, 0201 0201 RC0201JR-7D10KL Yageo America
R24, R25 2 2.2k RES, 2.20 k, 1%, 0.05 W, 0201 0201 CRCW02012K20FKED Vishay-Dale
R36, R37 2 10k RES, 10 k, 5%, 0.05 W, 0201 0201 RC0201JS-7D10KL Yageo America
www.ti.com Hardware Design Files
SLVUCP4 – NOVEMBER 2023
Submit Document Feedback
TPS25730 Evaluation Module 19
Copyright © 2023 Texas Instruments Incorporated