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Contains important information on installation, use, and maintenance.
Critical safety warnings regarding nozzle temperature, platform, high voltage, and power connections.
Recommendations for using specified printing materials to avoid damage and maintain quality.
Guidelines for optimal ambient temperature and filament storage for printing quality.
Visual overview and identification of the printer's external components.
Detailed specifications including printing size, speed, accuracy, and software compatibility.
Step-by-step instructions for installing the Wiibuilder slicing application.
Guide to configuring advanced slicing parameters within the Wiibuilder software.
Procedure for connecting the printer to a power source and powering it on.
Steps for correctly loading filament into the printer's extruder.
Steps involving TF card insertion and preparing the printer for printing.
How to select and start a print job from the operation panel.
Instructions on how to safely remove the finished print from the build platform.
Overview of the printer's LCD display and control knob functions.
Explanation of the menu tree structure and navigation within the control panel.
Key functions accessible via the control panel, such as printing from SD.
Process for heating the nozzle and bed to required temperatures before printing.
Steps for checking and adjusting printer temperatures and other functions.
Procedures for unloading and loading filament for replacement.
Using the control panel to manually move the printer axes and extruder.
Detailed guide for manually leveling the print bed for optimal adhesion.
Function to return the printer's nozzle and platform to their default home positions.
Methods to pause or stop an ongoing print job and resume it later.
How to manually set and adjust nozzle and bed temperatures.
Overview of essential daily checks and maintenance tasks for the printer.
Instructions for cleaning or replacing a clogged or worn printer nozzle.
Guide on replacing the build plate sticker for better model adhesion.
General| Build Volume | 150 x 150 x 150 mm |
|---|---|
| Layer Resolution | 0.05-0.3 mm |
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Supported Materials | PLA, ABS, PETG, TPU |
| Connectivity | USB, SD card |
| Nozzle Temperature | Up to 260°C |
| Bed Temperature | Up to 100°C |
| Frame | Metal |
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