Xilinx Kria K26 SOM - Connector Placement and Alignment

Note: PCB fab and assembly contractors must be able to produce carrier cards to the specicaons listed
in the PCB Fabricaon and Assembly House Requirements secon. In addion, the connectors that are
shied by 15% of the pad width must be capable of self-aligning aer a reow soldering process.
SOM to Carrier Card Samtec Connector
Placement Guidelines
Both the commercial (C) grade and industrial (I) grade SOMs have two Samtec 0.635 mm
AcceleRate
®
HD high-density, 4-row, 60-posion connectors. The Samtec part number is ADF6–
60–03.5–L–4–2–A. The connectors are placed on the boom side of the carrier card centered
between the mounng holes shown in Figure 2: K26 SOM Dimensions.
Board-to-board (B2B) mang connectors must be precisely placed on the PCB, parcularly for
mul-pair connector applicaons. Tight control is required during the board layout design and
the manufacturing process for product reliability and a decent yield rate. To avoid over-stressing
the mechanical design of the connectors and creang funconal damage during system assembly,
the next gure includes the recommended maximum posion tolerance of the connector. Auto-
placement machine accuracy and the tolerance of the connector pin solder pad posion
contributes to this recommendaon.
Chapter 3: Mechanical Design Considerations
UG1091 (v1.0) April 20, 2021 www.xilinx.com
Carrier Card Design for Kria SOM 40
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