Xilinx Kria K26 SOM - SOM System B2 B Connector Assembly Validation-DOE (to Ensure Time 0 no Crack)

SOM System B2B Connector Assembly
Validation-DOE (To Ensure Time 0 No Crack)
The Samtec ADF and ADM connectors placement were shied 0% and 15% (based on connector
pad diameter) on the X and Y-axis for both the SOM and carrier cards. The shied connectors
were reowed and were able to mate without any issue.
The mated connector boards were submied for cross secon tesng to validate their mang
condions. Based on the cross-secon images, the connectors which shied by 15% were able
to self-align during reow soldering. The following photos are a cross secon image of the mated
connectors. The proper contact of the female and male connector pins is achieved.
Figure 16: Cross-section Image of Mated Connectors for 0% Shift
Figure 17: Cross-section Image of Mated Connectors for 15% Shift
Chapter 3: Mechanical Design Considerations
UG1091 (v1.0) April 20, 2021 www.xilinx.com
Carrier Card Design for Kria SOM 54
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