Xilinx Kria K26 SOM - Page 43

During board-to-board inseron and removal, the installaon process should work within the
following recommended strain limits. The following gure shows the recommended locaons (E–
W, N–S) for a strain measurement on a carrier card. Diagonal strain should not exceed 500 micro-
strain during mang. Strain rate duraon taken to reach maximum 500 micro-strain should not be
less than four seconds. Based on experimental data, the maximum strain of 428 micro-strain
reached in 3.63 seconds duraon and was validated through dye and pry, where the sample
passed.
Figure 5: Recommended Locations for Strain Measurement on a Carrier Card
Board to Board Connector Distance Tolerance
Control
The distance between the mang ADM6 connectors on the carrier card must match the distance
between the ADF6 connectors on the SOM. The nal connector posion is dictated by auto-
placement machine accuracy and PCB pad posion tolerance. The way the distance is measured
between connectors is crucial to ensure seamless board-to-board mang, without applying
mechanical stress.
Chapter 3: Mechanical Design Considerations
UG1091 (v1.0) April 20, 2021 www.xilinx.com
Carrier Card Design for Kria SOM 43
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