Xilinx Kria K26 SOM - PCB Layout and Stencil Design

Board to Board Connector PCB Layout
Footprint Details
PCB pad design should be in a circular shape with diameter of 0.356 ±0.050 mm (14.0 ±2.0 mils).
Non-solder mask dened (NSMD) pad design as shown in the following gure is recommended
for beer reliability performance.
Figure 7: Recommended PCB Layout for Board to Board Connector
Board to Board Connector Pad Placement
The following gure outlines the carrier card connector pads and mechanical stando relave
placement.
Chapter 3: Mechanical Design Considerations
UG1091 (v1.0) April 20, 2021 www.xilinx.com
Carrier Card Design for Kria SOM 45
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