24 Chapter 1
Bluetooth
Audio Subsystem
Item Specification
Bluetooth
Controller
Foxconn BCM2070
BT2.1+EDR
(T77H114.01)
Foxconn BCM2046
BT2.1+EDR Module
(T60H928.33)
Foxconn AR3011 BT
Module (T77H056.00)
Features • Bluetooth 2.1
compliant
• Point-to-multipoint
operation
• External USB
interface for data
• Onboard antenna
and SMA RF
connector
• Coexistence
support
• Fully Qualified
Bluetooth v2.1 with
Class 2 specification RF
output power.
• Enhanced Data Rate
(EDR) compliant.
• Full Piconet and
Scatternet operation.
• Integrated PIFA
Antenna with better RF
performance.
• USB 2.0 compliant
interface.
• F/W upgradable via
Flash downloads.
• Very low power
consumption.
• Support Coexistence
with Intel WCS
(Wireless Coexistence
System) & AFH
(Adaptive Frequency
Hopping).
• Single-chip Bluetooth
v2.1 + EDR solution
• USB 2.0 full-speed
device interface with
support for Device
Firmware
Upgrade(DFU)
• SPI interface supports
external serial flash
devices
• Two on-chip 1.2V
linear voltage
regulators
• Integrated 32-bit CPU
with 32KB data RAM
and 256KB program
RAM
• On-board PLL
• On-chip low power
oscillator(LPO)
• WLAN coexistence
interface
• Standard USB HCI
interface
Item Specification
Audio Codec
Chipset Realtek ALC669X-GR
Package Intel Ibex Peak_M mBGA 676
Speaker Amplifier TPA6047A4
Audio port
Internal
Compatibility • EAX™ 1.0 & 2.0 compatible
• Direct Sound 3D™ compatible
• I3DL2 compatible
Sampling rate • Primary 16/20/24-bit SPDIF-OUT supports 32k/44.1k/48k/
88.2k/96k/192kHz sample rate
• Secondary 16/20/24-bit SPDIF-OUT supports 32k/44.1k/48k/
88.2k/96k/192kHz sample rate
External • Mic jack
• Headphone jack
• Line-in jack
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