iii
4-10 HOW TO UPDATE BIOS ............................................................................................42
4-11 AMD PLATFORM RAID FUNCTION INSTALLATION ..............................................43
4-12 PRO MAGIC PLUS FUNCTION INTRODUCTION.....................................................47
4-13 G.P.I FUNCTION LED DISPLAY................................................................................48
APPENDIX I..........................................................................................................................49
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHERBOARD AND
WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT
ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT
WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition May, 2010
Item Checklist
5
AMD 880G Platform Processor Chipset based motherboard
5
DVD for motherboard utilities
5
Switch Card
5
User’s Manual
5
4 in 1 cable package
AMD AM3 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing
operation clock, thermal management becomes increasingly crucial while building computer
systems. Maintaining the proper computing environment without thermal increasing is the key to
reliable, stable, and 24 hours system operation. The overall goal is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increasing surface area and concentrated airflow from attached active
cooling fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal
grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for
Socket AM3 processors by AMD. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support AM3 processors.
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