Levelflex FMP55
Endress+Hauser 53
Process
Process temperature range
The maximum permitted temperature at the process connection is determined by the O-ring version
ordered:
Device O-ring material Process temperature
FMP55 — –50 to +200 °C (–58 to +392 °F); completely coated
High process temperatures (> 150 °C (302 °F)) may possibly accelerate diffusion of the process
medium through the probe coating, which may reduce the operating time.
Process pressure range
Device Process pressure
FMP55 –1 to 40 bar (–14.5 to 580 psi)
This range may be reduced by the selected process connection. The pressure rating (PN)
specified on the flanges refers to a reference temperature of 20 °C, for ASME flanges 100 °F.
Pay attention to pressure-temperature dependencies.
Please refer to the following standards for the pressure values permitted for higher
temperatures:
• EN 1092-1: 2007 Tab. G.4.1-x
With regard to their temperature stability properties, the materials 1.4435 and 1.4404 are
grouped under 13E0 in EN 1092-1:2007 Tab. G.3.1-1. The chemical composition of the two
materials can be identical.
• ASME B 16.5a - 2013 Tab. 2-2.2 F316
• ASME B 16.5a - 2013 Tab. 2.3.8 N10276
• JIS B 2220
Dielectric constant (DC) and
conductivity
• DC (upper medium) ≤ 10
• DC (lower medium) - DK (upper medium) ≥ 10
• Interface thickness ≥ 60 mm (2.4 in)
• Conductivity (upper medium): ≤ 1 μS/cm
• Conductivity (lower medium): ≥ 100 μS/cm
Expansion of the rope probes
through temperature
Elongation through temperature increase from 30 °C (86 °F) to 150 °C (302 °F): 2 mm / m rope
length
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