Fibocom L610 Series - 3.1.2 Pin Definition

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FIBOCOM L610 Series Hardware Guide Page 16 of 59
heat sink pad is reserved for PCB packaging and welded.
3.1.2 Pin Definition
The pins are defined as follows:
Pin
Pin Name
I/O
Level
Reset
Value
Description
1
WAKEUP_IN
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/3.2V
L
External device wake-up module
Left floating when not in use
2
AP_READY
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/3.2V
H
The module detects whether the host
is sleeping
Left floating when not in use
3
SLEEP_IND
O
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
L
SLEEP_IND
Sleep mode indication
Left floating when not in use
4
W_DISABLE#
I
VILmin=-0.3V
VILmax=0.63V
VIHmin=1.2/2.2V
VIHmax=2.0/3.2V
L
Module flight mode control
Left floating when not in use
5
NET_MODE
O
VOHmin=1.35V
VOLmax=0.45V
L
Module network status indication
(Default)
Left floating when not in use
6
NET_STATUS
O
VOHmin=1.35V
VOLmax=0.45V
L
Module network status indication
Left floating when not in use
7
VDD_EXT
PO
1.8V
-
Module digital level, 1.8V output
Left floating when not in use
8
GND
G
-
-
Ground
9
GND
G
-
-
Ground
10
USIM_GND
G
-
-
Ground
11
DBG_RXD
I
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
-
DEBUG serial port Receive
Left floating when not in use