Fibocom L850-GL - User Manual

L850-GL Hardware User Manual
Version：1.0.6
Update date：Feb 26th, 2018

Summary

1 Foreword

1.1 Introduction

Describes electrical characteristics, RF performance, dimensions, and application environment of L850.

1.2 Reference Standard

Lists the standards the product design complies with.

1.3 Related Documents

Lists related documents for further reference.

2 Overview

2.1 Introduction

Introduces L850 as an integrated 4G WWAN module with M.2 form factor.

2.2 Specification

Details technical specifications including operating band, data transmission, power, temperature, and interfaces.

2.3 Warning

Provides warnings related to module operation and performance.

2.3.1 FCC Statement

Federal Communication Commission Interference Statement.

2.3.2 IC Statement

Industry Canada statement regarding interference and compliance.

2.3.3 CE Statement

EU Regulatory Conformance and Declaration of Conformity.

2.4 CA combinations

2.5 Application Framework

2.6 Hardware Block Diagram

3 Application Interface

3.1 M.2 Interface

Describes the standard M.2 Key-B interface of the L850 module.

3.1.1 Pin Map

Provides a detailed pin map for the M.2 interface.

3.1.2 Pin Definition

Defines the function and type of each pin in the M.2 interface.

3.2 Power Supply

3.2.1 Power Supply

Explains the power supply design and connection for the module.

3.2.2 Logic level

Defines the 1.8V and 3.3V logic level definitions for the module.

3.2.3 Power Consumption

3.3 Control Signal

3.3.1 Module Start-Up

Explains the module start-up process and circuit.

3.3.1.1 Start-up Circuit

Details the circuit design for module start-up controlled by AP.

3.3.1.2 Start-up Timing Sequence

Illustrates the timing sequence for module start-up.

3.3.2 Module Shutdown

3.3.3 Module Reset

3.3.4 PCIe Reset

3.4 PCIe & USB

3.4.1 PCle Interface

Details the PCIe 1.0 interface and data transmission channel.

3.4.1.1 PCle Interface Definition

Defines pins related to the PCIe interface.

3.4.1.2 PCle Interface Application

Shows reference circuit and PCB layout rules for PCIe interface.

3.4.2 USB Interface

3.4.2.1 USB Interface Definition

Defines pins related to USB 2.0 and USB 3.0 interfaces.

3.4.2.2 USB2.0 Interface Application

Shows the reference circuit for USB 2.0 interface.

3.4.2.3 USB3.0 Interface Application

Shows the reference circuit for USB 3.0 interface.

3.5 USIM Interface

3.5.1 USIM Pins

Defines the pins related to the USIM interface.

3.5.2 USIM Interface Circuit

Shows reference circuit designs for N.C. and N.O. SIM card slots.

3.5.3 USIM Hot-Plugging

3.5.4 USIM Design

3.6 Status Indicator

3.6.1 LED#1 Signal

Details the function of the LED#1 signal for status indication.

3.7 Interrupt Control

3.7.1 W_DISABLE1#

Explains the W_DISABLE1# pin for RF network enable/disable.

3.7.2 BODYSAR

Describes the Body SAR function using the DPR pin.

3.8 Clock Interface

3.9 ANT Tunable Interface

3.10 Configuration Interface

3.11 Other Interfaces

4 Radio Frequency

4.1 RF Interface

Details RF interface functionality and connectors.

4.1.1 RF Interface Functionality

Describes the function of Main and Diversity antenna connectors.

4.1.2 RF Connector Characteristic

Lists frequency range and characteristic impedance of RF connectors.

4.1.3 RF Connector Dimension

Shows the dimensions of the M.2 module RF connectors.

4.2 Operating Band

4.3 Transmitting Power

4.4 Receiver Sensitivity

4.5 GNSS

4.6 Antenna Design

5 Structure Specification

5.1 Product Appearance

Shows the appearance of the L850 module.

5.2 Dimension of Structure

Details the structural dimensions of the L850 module.

5.3 M.2 Interface Model

5.4 M.2 Connector

5.5 Storage

5.5.1 Storage Life

Specifies the recommended storage life of the module.

5.6 Packing

5.6.1 Tray Package

Details the tray packaging process for the module.

5.6.2 Tray size

Provides the dimensions of the pallet for tray packaging.

Fibocom L850-GL Specifications

General

Chipset	Intel XMM 7360
Form Factor	M.2
LTE Category	Cat 9
LTE Download Speed	450 Mbps
LTE Upload Speed	50 Mbps
3G Bands	B1/B2/B4/B5/B8
Operating Temperature	-10°C to +55°C
GNSS	GPS, GLONASS, BeiDou, Galileo
Storage Temperature	-40°C to +85°C
SIM Interface	1.8V/3.0V
LTE Bands	B1/B2/B3/B4/B5/B7/B8/B12/B13/B17/B18/B19/B20/B26/B28/B29/B30/B66
Operating Voltage	3.135V to 4.4V
Dimensions	30.0mm x 42.0mm x 2.3 mm
Interfaces	USB 2.0
Power Supply Voltage	3.135V to 4.4V
Operating Systems Support	Linux, Android, Windows
Certifications	FCC, IC, PTCRB, GCF, CE, RCM