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Max. Bed Temperature | 100 °C |
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Filament Diameter | 1.75 mm |
Technology | Fused Deposition Modeling (FDM) |
Nozzle Diameter | 0.4 mm |
Connectivity | USB, Wi-Fi |
Supported Materials | PLA, PETG, TPU, PA, PC |
Layer Resolution | 0.1-0.3 mm |