______________________________________________HARRIS
888-9058-001
WARNING: Disconnect and lockout AC primary power prior to servicing
202
To install the new FET:
A. Tin the bottom of the FET leads lightly with solder.
B. Use the following procedure for filling a syringe with thermal compound.
1. Required Equipment:
a. A 5mL syringe
b. Zinc oxide (Wakefield ) thermal compound
c. A stirrer (clean, no lint)
d. A clean cloth
2. Procedure:
a. On a clean, dry surface open the heat sink compound jar and stir
the compound thoroughly with a clean stirrer. Make sure there is
no settling in the compound before proceeding.
b. Assemble the syringe if necessary.
c. Put syringe tip in the compound up to the beginning of the barrel
of the syringe.
d. Push and pull plunger several times while the tip is in the
compound (2 to 4 times) to make sure there are no air gaps when
filling the syringe.
e. With the tip of the syringe still in the compound, begin swirling
the tip around in the compound while drawing back the plunger to
fill the syringe to 5mL.
f. Remove syringe from compound and clean off carefully with the
clean cloth.
C. Apply heat sink compound on the RF FET.
1. Required Equipment:
a. Xacto knife (blade #11). Use only a fresh blade for this
procedure (no nicks or mars, has not been used for anything else.
When in doubt, change the blade)
b. Cleaning solvent
c. Q-tip
d. Wakefield compound in new 5mL syringe
e. A clean cloth
f. ESD (electro static discharge) equipment
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