NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
● Discrete graphics: Thermal paste is used on the heat sink (2) (4) and associated system board
components (1) (3).
● UMA graphics: Thermal paste is used on the heat sink (2) and associated system board component (1).
Reverse this procedure to reassemble and install the heat sink assembly.
Component replacement procedures 55
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