HP 7500 Series - Temperature; Humidity; Cleanness

3
Temperature
CAUTION:
If condensation appears on the chassis when you move it to a high-temperature environment, dry the
chassis before powering it on to avoid short circuits.
To guarantee the normal operation of the switch, the room temperature must meet the requirements
in Table 2.
Table 2 Temperature r
equirements
Tem
p
erature Ran
g
e
Operating temperature 0°C to 45°C (32°F to 113°F)
Storage temperature –40°C to +70°C (–40°F to +158°F)
Humidity
Maintain appropriate humidity in your equipment room, as described in Table 3.
• Lasting high relative humidity tends to cause poor insulation, electricity creepage, mechanical
property change of materials, and corrosion of metal parts.
• Lasting low relative humidity is likely to result in loose screws due to washer contraction, and even
ESD, which causes the circuits to fail.
Table 3 Humidity requirements
Humidit
y
Ran
g
e
Operating humidity 10% to 95%, noncondensing
Storage humidity 5% to 95%, noncondensing
Cleanness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 4 Dust concentration limit in the equipment room
Substance Concentration limit (
p
articles/m
3
)
Dust particles
≤ 3 x 10
4
(No visible dust on desk in three days)
NOTE:
Dust particle diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in Table 5.