HP BladeSystem c7000 Quick Setup Instructions

10
To support network connections for specific signals, install an
interconnect module in the bay corresponding to the embedded NIC or
mezzanine signals.
Interconnect device mapping for double dense server
blades
The following table lists the available configurations for double dense
server blades installed in device bay N (1-16).
Connection Port number
Connects to
interconnect bay/port
Server A
Embedded NIC
NIC 1 (ENET:1)
NIC 2 (ENET:2)
1/Port N
3/Port N
Server A
Mezzanine
Port 1
Port 2
5/Port N
6/Port N
Server B
Embedded NIC
NIC 1 (ENET:1)
NIC 2 (ENET:2)
2/Port N
4/Port N
Server B
Mezzanine
Port 1
Port 2
7/Port N
8/Port N
Interconnect device mapping for AMC Telco I/O
expansion blades
The following table lists the available configurations for AMC Telco
I/O expansion blades installed in device bay N (1-16).
Connection Port number
Connects to
interconnect bay/port
AMC Embedded
(1)
Port 1
Port 2
Port 3
Port 4
1/Port N
2/Port N
3/Port N
4/Port N
AMC Embedded
(2)
Port 5
Port 6
Port 7
Port 8
5/Port N
6/Port N
7/Port N
8/Port N
Bay-to-bay crosslinks
Four trace SerDes signals between adjacent bays are provided in the
enclosure midplane to permit bay-to-bay communications. Interconnect
modules can only connect horizontally.
Device bay crosslinks
Device bay crosslinks are wired between adjacent horizontal device
bay pairs.
For half-height blades, these signals connect a four-lane PCIe module to
a partner blade such as a tape blade or a PCI expansion blade. For
full-height blades, these signals are used to connect a PCIe module to a
partner blade in the lower adjacent bay and require a PCIe pass-thru
mezzanine card installed in mezzanine connector 3. The Onboard
Administrator with KVM disables the device bay crosslinks when they
cannot be used, such as when two server blades reside in adjacent
device bays.
Interconnect bay crosslinks
Interconnect bay crosslinks are wired between adjacent interconnect
bay pairs.
You can enable these signals to provide module-to-module
connections, such as Ethernet crosslink ports between matching
switches, or Virtual Connect modules as stacking links. Onboard
Administrator with KVM disables the interconnect bay crosslinks when
they cannot be used, such as when two different modules reside in
adjacent horizontal interconnect bays.

HP BladeSystem c7000 Specifications

General

Form Factor	10U
Number of Bays	16
Redundant Power	Yes
Redundant Fans	Yes
Maximum Blade Servers	16 half-height or 8 full-height
Operating Temperature	10° to 35°C (50° to 95°F)
Power Supplies	Up to 6
Cooling Fans	10
Management	Onboard Administrator
Interconnect Modules	Up to 8
Networking Options	Ethernet, Fibre Channel, InfiniBand
Compatibility	HP ProLiant and Integrity server blades
Relative Humidity	10% to 90% (non-condensing)