Removal and replacement procedures 70
o Front I/O assembly removal in an SFF chassis
To replace the component, reverse the removal procedure.
Quick-release latch rack ear assembly
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, take the appropriate anti-static
precautions before beginning any installation, removal, or replacement procedure. Improper
grounding can cause electrostatic discharge.
To remove the component:
1. Power down the server (on page 27).
2. Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3. Remove the server from the rack (on page 30).
4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
5. Remove the access panel ("Access panel" on page 37).
6. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage
("Remove the PCI riser cages" on page 31).
7. Release the front I/O cabling from the server:
a. Detach the ambient thermal sensor cable from its clip.
b. Release the ambient thermal sensor cable from the front chassis cable clip.
c. Disconnect the USB 3.0 cable.
d. Disconnect the front I/O assembly cable.
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