Introduction
8 AS/400e System Handbook
• LPDA-1 (Link Problem Determination Aids). This is a diagnostic function supported by
some (primarily older IBM) modems.
• V.54 local and remote loopback (diagnostic functions supported by some modems).
AS/400 Technology in Stride
The AS/400 system delivers tremendous capacity growth in its product line. The Technology
Independent Machine Interface (TIMI) has made it possible to completely change the
underlying hardware with minimum, if any, impact to AS/400 applications. TIMI helps
condition the AS/400 system to bring new technology to market.
In 1997, the 12-way AS/400 system was delivered using Power PCA35 microprocessors.
Known as Apache technology, the Power PCA35 microprocessors provided a 4.6x growth.
In September 1998, the 12-way AS/400 system was delivered using the Power PCA50
microprocessor. Known as code name Northstar, the Power PCA50 microprocessors nearly
doubled the high-end capacity. This set of processors provided the fourth generation since
the AS/400 system’s inception in 1988 with 64-bit AS/400 Power PCs microprocessors.
Again in 2000 the AS/400e is leading the industry by delivering the first server with the new
“Silicon-on-Insulator” (SOI) technology. SOI represents a fundamental advance in the way
chips are built. IBM's unique SOI process alters the design of transistors, essentially “turbo
charging” them so they run faster and use less power. For example, a microprocessor
designed to operate at a given speed can instead be built using SOI technology to achieve
higher speeds. At the same time, if performance levels are held constant, SOI chips can
require as little as one-third the power of today's microchips. Silicon on Insulator is
technology used by the ISTAR processors, the transistors are built within and on top of a thin
layer of silicon that is on top of an insulating layer. The insulating layer is fabricated by
implanting a thin layer of oxide beneath the primary silicon surface of the wafer.
PULSAR and ISTAR processors use on-chip copper-wiring technology. The PULSAR
processors integrate IBM CMOS7S technology. ISTAR processors integrate CMOS8S
technology. Previously, Northstar technology used aluminum for on-chip wiring. Copper's
better conductivity permits thinner wires to be used, which enables the transistors to be
packed closer together. The denser new technology permits additional micro-architecture
methods to improve performance.
Keeping multiple levels of high speed cache is still necessary to keep the processors busy.
Denser processor technology permits more on-chip cache. All this new technology is
implemented on the new AS/400e servers.
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