Intel EM64T - Celeron D 336 Boxed Ena User Manual

Thermal Metrology
R
26 Thermal/Mechanical Design Guide
Ψ
CS
is strongly dependent on the thermal conductivity and thickness of the TIM between the
heatsink and IHS.
Ψ
SA
is a measure of the thermal characterization parameter from the bottom of the heatsink to the
local ambient air. Ψ
SA
is dependent on the heatsink material, thermal conductivity, and geometry.
It is also strongly dependent on the air velocity through the fins of the heatsink.
Figure 4 illustrates the combination of the different thermal characterization parameters.
Figure 4. Processor Thermal Characterization Parameter Relationships
TIM
T
S
T
A
Ψ
CA
LGA775 Socket
Processor
IHS
System Board
T
C
Heatsink
TIM
T
S
T
A
Ψ
CA
LGA775 Socket
Processor
IHS
System Board
T
C
Heatsink
3.1.1 Example
The cooling performance, Ψ
CA,
is then defined using the principle of thermal characterization
parameter described above:
• The case temperature T
C-MAX
and thermal design power TDP given in the processor
datasheet.
• Define a target local ambient temperature at the processor, T
A
.
Since the processor thermal profile applies to all processor frequencies, it is important to identify
the worst case (lowest Ψ
CA
) for a targeted chassis characterized by T
A
to establish a design
strategy such that a given heatsink can cover a given range of processor frequencies.
The following provides an illustration of how one might determine the appropriate performance
targets. The example power and temperature numbers used here are not related to any Intel
processor thermal specifications, and are for illustrative purposes only.
Assume the TDP, as listed in the processor datasheet, is 100 W and the maximum case
temperature from the thermal profile for 100 W is 67 °C. Assume as well that the system airflow

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English