Intel EM64T - Celeron D 336 Boxed Ena User Manual

Intel® Thermal/Mechanical Reference Design Information
R
46 Thermal/Mechanical Design Guide
5.6 ATX Reference Thermal Mechanical Solution for the
Intel
®
Pentium
®
4 Processor in the 775–Land LGA
Package
The reference thermal solution is an active air-cooled design, with a fan installed at the top of the
heatsink. This solution is called the Intel
®
Radial Curved Bifurcated Fin Heatsink Reference
Design (Intel
®
RCBFH-3 Reference Design).
The reference solution is compliant with the reference ATX motherboard keep-out and height
recommendations defined in Section
5.5.
The solution comes as an integrated assembly (
Figure 10). An exploded view of the assembly is
provided in
Figure 11. The solution is purposely designed without a fan guard to optimize thermal
and acoustic performance.
Note: If this fan design is used in your product and you will deliver it to end use customers, you have
the responsibility to determine an adequate level of protection (e.g., protection barriers, a cage, or
an interlock) against contact with the energized fan by the user during user servicing.
Table 4. Intel
®
RCBFH-3 Reference Design Performance
Fan Set Point Fan Speed
Validated Thermal
Performance Ψca
(Mean + 3σ)
Validated Acoustic
Performance
(LwAd)
T
A
Assumption
High 3600 RPM 0.29 °C/W 5.5 BA T
A
= 38 °C
Low 2400 RPM 0.325 °C/W 4.5 BA T
A
= 30 °C
Note: RCBFH-3 performance in Table 4 is relative to the Intel Pentium
®
4 Processor 5xx sequence.
Refer to
Table 2 for performance of the RCBFH-3 with the other processors.
Figure 10. Intel
®
RCBFH-3 Reference Design
Fan
Extrusion + Copper Core
FastenerClip
Fan
Extrusion + Copper Core
FastenerClip

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English