Intel® Thermal/Mechanical Reference Design Information
R
42 Thermal/Mechanical Design Guide
5.2 Environmental Reliability Testing
5.2.1 Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given
thermal solution in the assembled state. The thermal solution should meet the specified thermal
performance targets after these tests are conducted; however, the test conditions outlined here
may differ from your own system requirements.
5.2.1.1 Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Figure 8. Random Vibration PSD
5.2.1.2 Shock Test Procedure
Recommended performance requirement for a motherboard:
• Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in/sec minimum velocity change.
• Setup: Mount sample board on test fixture.
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