48
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 55
o
C at the processor fan inlet is
recommended. If the internal ambient temperature exceeds 55
o
C, further thermal testing is
required to ensure components do not exceed their maximum case temperature.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal
performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see
the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in shorter than expected product lifetime. Figure 17 shows the locations of the
localized high temperature zones. Figure 17 shows the locations of the localized high temperature
zones.
Figure 17 shows the locations of the localized high temperature zones.
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