Intel S1400SP User Manual

Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPSDesign and Environmental Specifications
Revision 1.1
Intel order number G34153-003
115
9.3.1 Processor Power Support
The server boards support the Thermal Design Power (TDP) guideline for Intel
®
Xeon
®
processors. The Flexible Motherboard Guidelines (FMB) is followed to determine the suggested
thermal and current design values for anticipating future processor needs. The following table
provides maximum values for DTS, TDP power and T
CASE
for the compatible Intel
®
E5-2600
processor family series.
Table 62. Intel
®
Xeon
®
Processor Dual Processor TDP profile
Max TDP Power
Max Tcase (°C)
Max DTS (°C)
130W
85°C
104.4 for 6 core
100 for 8 core
150W
67°C
84.8
9.4 Power Supply Output Requirements
This section is for reference purposes only. The intent is to provide guidance to system
designers to determine a power supply to use with these server boards. This section specifies
the power supply requirements Intel used to develop a power supply for its server system.
9.4.1 Output Power/Currents
The following tables define the minimum power and current ratings. The power supply must
meet both static and dynamic voltage regulation requirements for all conditions.
Table 63. Minimum Load Ratings
Parameter
Min
Max.
Peak
Unit
3.3V
0.5
18.0
A
5V
0.3
15.0
A
12V1
0.7
24.0
28.0
A
12V2
0.7
24.0
28.0
A
12V3
1.5
18.0
A
 12V
0.0
0.5
A
5Vstby
0.0
3.0
3.5
A
Notes:
1. Combined continuous power for all output shall not exceed 550W.
2. Peak combined power for all outputs shall not exceed 630W for 20 seconds.
3. Max combined power of 12V1, 12V2, and 12V3 shall not exceed 530W.
4. Max combined power on 3.3V and 5V shall not exceed 120W.
9.4.2 Cross Loading
The power supply shall maintain voltage regulation limit when operated over the following cross
loading conditions.

Intel S1400SP Specifications

General

Brand	Intel
Model	S1400SP
Category	Motherboard
Language	English