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Kemppi MF 33 Service Manual

Kemppi MF 33
36 pages
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IGBT replacing
Mounting the IGBT to the heat sink
The tools and premises used in this work must be clean and free of dirt and dust. Even very
small particles (0,050mm) between the surfaces may increase the gap between heatsink and
module, causing overheating ans possible damage.
Heat transfer compound is to be spread in even layer of approximately 0,1 mm onto the module
base. Then the module should be immediately mounted on the heatsink, in order to minimize
the possibility of dirt getting between the components.
Firts, all the M5 type screws are tightened 0,5...2 NM. After a few minutes the module can be
tightened into the torque of 3 NM.
36

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Kemppi MF 33 Specifications

General IconGeneral
BrandKemppi
ModelMF 33
CategoryWelding System
LanguageEnglish

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