Contents
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety inspection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. General checkout . . . . . 21
What to do first . . . . . . . . . . . . . . . 21
Checking the ac power adapter . . . . . . . . 22
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 23
FRUs (CRUs) . . . . . . . . . . . . . . . 23
Chapter 4. Removing a FRU or
CRU . . . . . . . . . . . . . . . . . . 29
General guidelines. . . . . . . . . . . . . . 29
Remove the lower case . . . . . . . . . . . . 29
Remove the battery pack . . . . . . . . . . . 31
Remove the Wi-Fi card . . . . . . . . . . . . 32
Remove the M.2 solid-state drive . . . . . . . . 35
Remove the memory module . . . . . . . . . 37
Remove the fingerprint board . . . . . . . . . 38
Remove the speakers . . . . . . . . . . . . 40
Remove the I/O board . . . . . . . . . . . . 41
Remove the thermal module . . . . . . . . . . 42
Remove the system board. . . . . . . . . . . 44
Remove the dc-in cable. . . . . . . . . . . . 46
Remove the upper case (with keyboard) . . . . . 48
Disassemble the LCD module . . . . . . . . . 49
Remove the LCD panel . . . . . . . . . . 49
Remove the EDP cable, camera board, and
microphone board . . . . . . . . . . . . 51
Remove the hinges. . . . . . . . . . . . 53
Appendix A. Label locations. . . . . . 55
Trademarks . . . . . . . . . . . . . . . . lvii
© Copyright Lenovo 2019 iii